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DCB Substrate - Hubert Heusner - MMC & SPUTTER Targets
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MMC & SPUTTER TARGETS

We are an solution provider in power technology, sputter targets and hot pressing. Sputter Targets, MMC (Metal Matric Composits) and CMC (Ceramic Matric Composits) from lot size ONE to medium value can be delivered from us.

Metal-Diamond composites such as aluminium-diamond, copper-diamond or silver-diamond are composite materials which allow to combine a high thermal conductivity (range from 300 to 650 W/mK) with a tailored (significantly reduced) coefficient of thermal expansion (between 6 to 12 ppm/K). These materials are of interest for applications as heat sinks, heat spreaders, heat slugs or base plates to provide a reliable and sufficient cooling.

We offers Metal-Diamond composites with properties tailored in a certain range. Aluminium-Diamond, Copper-Diamond and Silver-Diamond MMCs.

Metal Matrix Comosites ( MMC) and  Metal-Diamond Composites

  • The combination of a metallic matrix (e.g. Cu, Ag or Al) with a high termal conductivity in combination with a reinforcement such as diamond with a low Coefficient of Thermal Expansion (CTE) resultes in a material with tailorable thermal properties.

  • The theraml conductivity can be varied between 300 t0 650 W/mk
    ( Kupfer (400 W/mk), Silber ( 430 W/mk) ) und Aluminium 240 W/mk)

  • The coefficient of thermal expansion can be varied between 8 ppm/K
    to14 ppm/k

Typical Applications:
  • Heat Sink of Heat Spreaders in CPUs
  • Base plates in Power Electronics (e.g. IGBT base plates)
  • Heat Spreders for LED and HB-LEDs
  • Heat Sink for RF packages
  • Heat Sink for microelectronic packages
  • Thermal management of high thermal loaded electronic components

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Sputter Targets on Demand

  • We offer the customized fabrication of targets for sputtering, arc deposition and other thin film deposition techniques with special compositions.

  • Batch size ONE is the start for us. We deliver with very short lead time.

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Advanced Ceramics

  • We offer a broad variety of semifinished ceramic plates made of various materials such as nitrides

  • (e.g. Si3N4, AlN,..), carbides (WC, SiC,..) or complex borides (TiB2, AlMgB14,..).

  • The size of the semifinished parts can range from 10 mm in diameter to 205 mm.

  • Typical geometries: 10 mm x 10 mm up to 200 mm x 200 mm (for some materials up to 250mmx250mm)

 

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Rapir Hot Pressing

  • is a pressure assisted sintering technique allowing  the consolidation of high performance materials such as special alloys.
  • Ceramics as well as metal or ceramic matrix composites up to a temperature of 2.400°C. This is possible in overall cycle times of less than one hour and therefore very economic.

We have 3 differend Rapit Hot Pressung processes

Materials:

  • WC without binder
  • W, Mo, Nb, and Ta-Oxide
  • Ti Carbid, Boride or Nitride
  • Cr, or Ti Siliczium
  • ZnS/SiO2
  • Sulfide like MoS2, WS2
  • Different metal allyies and ceramic combination
  •  

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