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DCB Substrate - Hubert Heusner - Sputter Targets on Demand
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Sputter Targets on Demand

Sputtering Targets designed to YOUR requirements

  • customized material composition
  • flexible in geometry and design
  • from prototype to series production
  • individual design of microstructure

Target Composition

Within  the  past  10  years  we  have processed and worked on more than 500 different compositions and every
week we address new challenges with respect to the composition.

The variety of materials covers pure metals to ceramics including precious metals, oxides, nitrides, carbides, borides, sulfides, ..

Processing

We have  several possibilities inhouse for the development and manfuacturing of sputtering target  materials  with  customised compositions.

Together with possibilites for machining we are able to finish a huge variety of materials ranging from soft metals to ult-
rahard materials such as borides, nitrides or carbides.

Geometry, Size & Shape

With our available processing techniques we can cover a large variety of geometries ranging from circular plates to square or rectangular plates. 

Even  cyclindrical  targets  or target  segments  can  be  produced within certain limitations. The maximum  monolithic plate size is in the range of 20 mm to 300 mm or squares/ rectangels with up to 200 mm.

Larger dimensions can be made from segments can be made from segments.

Samples with pictures

 

Sputter Targets

  • WC without binder
RHP-SPT-Rechteckig-gestabelt-400.jpg

Sputter Target

  • Ru
RHP-SPT-Ru-400.jpg

Sputter Target

  • HfO2 target segnebts with size of 200mm x 125mm
RHP-SPT-HfO2-segmensts-400.jpg

Sputter Targets

  • Thungsten Carbide without binder
RHP-SPT-Thungsten-Carbide-400.jpg

Sputter Target

  • TiN
RHP-SPT-TiN-400.jpg

Sputter Target

  • Bondet Target
RHP-SPT-rund-gebondet-400.jpg

Sputter Target

  • Varios alloys or metal / ceramic combinations
RHP-SPT-rund-gestabelt-400.jpg

Platinen© 2012 Hubert Heusner Industrievertretung Print Version Handelnach oben